408.437.1931
sales@PowerDesignServices.com
121 E. Brokaw Road San Jose, CA 95112
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PCB Manufacturing Capabilities

PCB Fabrication | PCB Manufacturing Capabilities | PCB Design Rules | PCB Equipment | Materials | Flex Circuit
TechnologiesPlating
  • Maximum board size 18"x22"
  • Multi-layers up to 32 layer
  • 3 mil trace width
  • 3 mil air gap
  • Board thickness up to .250
  • Lowest SMD pitch .006
  • Core thickness .002
  • Prepreg spacing .0018
  • Smallest drill .006
  • Slot size .020
  • Copper wt 1/4-4oz
  • Blind and Buried Vias
  • BGA/Flip Chip Design
  • Wireless/Microwave Products
  • FR-4
  • Flex
  • Rigid-flex
  • Polyimide
  • Arlon
  • Taconic
  • Polyflon
  • Rogers
  • TMM
Surface FinishTesting (Netlist)
  • Gold immersion
  • Soft bondable gold
  • Hard gold
  • Tin immersion
  • Solder
  • Entek
  • Dual Access
  • Flying Probe
  • AOI
  • TDR

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