- Maximum board size 18"x22"
- Multi-layers up to 32 layer
- 3 mil trace width
- 3 mil air gap
- Board thickness up to .250
- Lowest SMD pitch .006
- Core thickness .002
- Prepreg spacing .0018
- Smallest drill .006
- Slot size .020
- Copper wt 1/4-4oz
- Blind and Buried Vias
- BGA/Flip Chip Design
- Wireless/Microwave Products
| - FR-4
- Flex
- Rigid-flex
- Polyimide
- Arlon
- Taconic
- Polyflon
- Rogers
- TMM
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