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      PCB Manufacturing Capabilities
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    Technologies Plating
    • Maximum board size 18"x22"
    • Multi-layers up to 32 layer
    • 3 mil trace width
    • 3 mil air gap
    • Board thickness up to .250
    • Lowest SMD pitch .006
    • Core thickness .002
    • Prepreg spacing .0018
    • Smallest drill .006
    • Slot size .020
    • Copper wt 1/4-4oz
    • Blind and Buried Vias
    • BGA/Flip Chip Design
    • Wireless/Microwave Products
    • FR-4
    • Flex
    • Rigid-flex
    • Polyimide
    • Arlon
    • Taconic
    • Polyflon
    • Rogers
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    Surface Finish Testing (Netlist)
    • Gold immersion
    • Soft bondable gold
    • Hard gold
    • Tin immersion
    • Solder
    • Entek
    • Dual Access
    • Flying Probe
    • AOI
    • TDR

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    1650 Zanker Road, San Jose, CA  95112 | Call PDS Today: (408) 437-1931