PCB Assembly Technologies

Our PCB Assembly Technologies

Power Design Services has experience with the latest of PCB and assembly technologies including:

 PCB Assembly Technologies PCB Assembly Technologies
  • Arlon DiClad and CuClad series
  • Automatic Stencil Screen Printing
  • BGA / Flip Chip / Stacked Chip (PoP)
  • BGA Rework
  • Blind and Buried Vias
  • Board Sizes to 22″x24″
  • Cable Assembly
  • DRC and DFM Feedbacks
  • Final Box Build
  • Flex Circuits
  • Functional Testing
  • Getek
  • Hand Assembly on Small Prototype Jobs
  • Hybrid Assembly
  • Lead-free (RoHS)
  • Low SMD pitch
  • Material Management
  • Micro BGA down to 03mm
  • Park-Nelco
  • Pick-n-Place
  • Plating
  • Pyralux LF, FR and AP
  • Quick turn down to 24 hour
  • Rigid PCB
  • Rigid-Flex PCB
  • Rogers Corporation RF / Microwave / High Speed Laminates
  • Small Part Size down to 01005
  • Standard Rigid FR4
  • Testing (Netlist)
  • Through-hole
  • Turnkey Solution
  • Various surface finishes
  • Via-n-Pad Technology
  • …Just Ask!

Logo1
Logo2
Logo3
Logo4
Logo5
Logo6
Logo7
Logo8

Contact us

Power Design Services
121 E. Brokaw Road
San Jose, CA 95112
408-437-1931
sales@PowerDesignServices.com

Certifications

Power Design Manufacturing Is now

ITAR, ISO-9001:2008
Click here for Certificate