PCB Material Options
Standard Rigid FR4
|PCB with Heavy Copper
|3.3 mil Flex Board
|You Name It, We Do It
Designed for use in high density multi-layer boards, FR4 is suitable for surface mount, MCM-Ls, direct chip attach, automotive and wireless communications. The characteristics of FR4 also make it particularly beneficial in high volume fine line multilayers and PCMCIA applications.
The predictability and consistency of this material provides for tremendous ease of processing at the circuit board fabrication site, and its electrical and mechanical characteristics make it user friendly for both designers and fabricators of critical circuits.
Flex and Rigid-Flex
Flex and Rigid-flex circuit boards have become increasing popular due to their unique applications. Flex and Rigid-Flex circuit boards can do what regular standard rigid circuit boards can not do. They can fold, twist, and wrap around tight/small packaging areas.
Most flex circuit boards are being manufactured using “Kapton”, a material developed by Dupont Corporation. This polyimide film based material is resistant to heat, has dimensional stability and a low dielectric constant of 3.6. There are three variants of the Kapton material:
- Pyralux LF (Acrylic Base Adhesive-not Flame Retardant)
- Pyralux FR (Acrylic Base Adhesive-Flame Retardant)
- Pyralux AP (Adhesiveless-for more demanding high-performance applications)
Learn more about Kapton at www.Dupont.com
As microprocessor speeds continue to escalate and wireless communications proliferate, the need for a fast and cost effective solution becomes paramount. Power Design Services has over 10 years of experience working with different type of laminates.
- 5870/5880 series
- 3003/3006/3010 series
- 6002/6006 series
- 4003/4350 series
DiClad and CuClad series
N4000 series/ N5000 series/ N6000 series/ N7000 series/ N8000 series
- Loss tangent = .012 (slightly high) (usage in analog circuits up to 1.2 ghz and up to 2.0 ghz in digital applications) (Stability in temperature variations good)
- Er = 3.5 to 4.3 (at 1.0 mhz) (specific Er is dependent on glass-resin- ration – Er is virtually constant form 1.0 mhz to 2.0 ghz)
- CTEr = +220ppm per degree C (high). Tg is 180 degrees C.
- Electro-deposited Copper only. (helps in peel strength and delamination but somewhat limits etch width tolerance due to undercutting).